3Dfx Team

osckhar · Site Admin Joined: 09 Dec 2005 Posts: 559 Location: Spain

Hello,

Own a Rampage Brings Up board with test socket is an amazing tool for diagnose but the main problem is insert/remove the chip balls are deteriorated until card can looses the contact between test socket and pads.

I had to do a full Reballing with leaded balls for my own Chip once it stopped to work for bad contact. Process is not easy since there are not stencils for such size BGA and second problem is the tape over the chip is very delicated and it protects balls are not in contact with.

TAKE OUT SOLDER BALLS

CLEAN PADS

BUILD A CUSTOM STENCIL BGA

CHECKING THE PROCRESS

HEATING CHIP BGA

PROCESS ENDED

PERFECT REBALLING

Regards,
Oscar.
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